Remarkable Thermal Conductivity of Epoxy Composites Filled with Boron Nitride and Cured under Pressure
This work demonstrates that the application of even moderate pressures during cure can result in a remarkable enhancement of the thermal conductivity of composites of epoxy and boron nitride (BN). Two systems have been used: epoxy-thiol and epoxy–diamine composites, filled with BN particles of diffe...
| Autores: | , , , |
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| Tipo de documento: | artigo |
| Data de publicação: | 2021 |
| País: | España |
| Recursos: | Universitat Politècnica de Catalunya (UPC) |
| Repositório: | UPCommons. Portal del coneixement obert de la UPC |
| Idioma: | inglês |
| OAI Identifier: | oai:upcommons.upc.edu:2117/345889 |
| Acesso em linha: | https://hdl.handle.net/2117/345889 https://dx.doi.org/10.3390/polym13060955 |
| Access Level: | Acceso aberto |
| Palavra-chave: | Epoxy compounds Calorimetry Thermal conductivity Epoxy composites Boron nitride Density Pressure Differential scanning calorimetry (DSC) Epòxids Calorimetria Calor -- Transmissió Àrees temàtiques de la UPC::Enginyeria dels materials Àrees temàtiques de la UPC::Física::Termodinàmica |
| Resumo: | This work demonstrates that the application of even moderate pressures during cure can result in a remarkable enhancement of the thermal conductivity of composites of epoxy and boron nitride (BN). Two systems have been used: epoxy-thiol and epoxy–diamine composites, filled with BN particles of different sizes and types: 2, 30 and 180 µm platelets and 120 µm agglomerates. Using measurements of density and thermal conductivity, samples cured under pressures of 175 kPa and 2 MPa are compared with the same compositions cured at ambient pressure. The thermal conductivity increases for all samples cured under pressure, but the mechanism responsible depends on the composite system: For epoxy–diamine composites, the increase results principally from a reduction in the void content; for the epoxy–thiol system with BN platelets, the increase results from an improved matrix-particle interface; for the epoxy–thiol system with BN agglomerates, which has a thermal conductivity greater than 10 W/mK at 44.7 vol.% filler content, the agglomerates are deformed to give a significantly increased area of contact. These results indicate that curing under pressure is an effective means of achieving high conductivity in epoxy-BN composites. |
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